Nonvolatile semiconductor memory device

ABSTRACT

A memory cell includes a floating gate electrode, a first inter-electrode insulating film and a control gate electrode. A peripheral transistor includes a lower electrode, a second inter-electrode insulating film and an upper electrode. The lower electrode and the upper electrode are electrically connected via an opening provided on the second inter-electrode insulating film. The first and second inter-electrode insulating films include a high-permittivity material, the first inter-electrode insulating film has a first structure, and the second inter-electrode insulating film has a second structure different from the first structure.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromprior Japanese Patent Application No. 2007-222601, filed Aug. 29, 2007,the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a structure of a peripheral transistorin a nonvolatile semiconductor memory device.

2. Description of the Related Art

In nonvolatile semiconductor memory devices such as NAND type flashmemories, an FN (Fowler-Nordheim) tunnel current is applied to a gateinsulating film so that a floating gate electrode (charge storage layer)is filled with electric charges at the time of writing. At this time, apositive voltage of 15 to 40V is applied to the control gate electrode.

When a capacitance ratio (coupling ratio) of the gate insulating filmand an inter-electrode insulating film (dielectric film) of a memorycell is large, a high electric field is generated efficiently on thegate insulating film. As a result, a writing characteristic is improved.

Therefore, a technique using a high-permittivity (High-k) material foran inter-electrode insulating film has been proposed as a technique forimproving the coupling ratio (for example, see Jpn. Pat. Appln. KOKAIPublication Nos. 2005-277171 and 2006-186073).

The nonvolatile semiconductor memory devices include a memory cell and aperipheral transistor. Both of them are formed by common processes asmuch as possible in order to reduce the process cost.

For this reason, the peripheral transistor has a structure similar to amemory cell, namely, a stack structure of lowerelectrode/inter-electrode insulating film/upper electrode. The lowerelectrode and the upper electrode are electrically connected via anopening provided on the inter-electrode insulating film.

In this case, the high-permittivity material which is adopted forimproving the coupling ratio of the memory cell is used also for theinter-electrode insulating film of the peripheral transistor.

However, the high-permittivity material which is used for theinter-electrode insulating film of the peripheral transistor causes aproblem that an off-leak current of the peripheral transistor increasesand a field isolation breakdown voltage is lowered.

For example, when the high-permittivity material includes a metal oxidefilm or a raw material gas which is used for depositing the metal oxidefilm includes carbon atoms, the carbon atoms diffuse on a surface of asemiconductor substrate and a bottom portion of a field isolationinsulating film.

When the high-permittivity material includes a nitride film obtained byplasma nitridation, nitrogen radicals at the time of depositionsimilarly diffuse on the surface of the semiconductor substrate and thebottom portion of the field isolation insulating film. As a result, aparasitic transistor is formed, which causes a problem that an off-leakcurrent of the peripheral transistor increases and the field isolationbreakdown voltage decreases.

Also after the inter-electrode insulating film is deposited, the carbonatoms and/or the nitrogen atoms in the inter-electrode insulating filmdiffuse. As a result, fixed electric charges are generated in an elementarea, and the performance of the peripheral transistor is possiblydeteriorated.

If the high-permittivity material is intended to be used for theinter-electrode insulating film of the memory cell, the problems, suchas the increase in the off-leak current and the reduction in the fieldisolation breakdown voltage, should be eliminated, in view of processintegration, without increasing the number of steps of a manufacturingprocess (process cost).

BRIEF SUMMARY OF THE INVENTION

A nonvolatile semiconductor memory device according to an aspect of theinvention comprises a memory cell and a peripheral transistor, which areprovided on a semiconductor substrate. The memory cell includes firstand second diffusion layers, a first gate insulating film which isprovided on a first channel region between the first and seconddiffusion layers, a floating gate electrode which is provided on thefirst gate insulating film, a first inter-electrode insulating filmwhich is provided on the floating gate electrode, and a control gateelectrode which is provided on the first inter-electrode insulatingfilm. The peripheral transistor includes third and fourth diffusionlayers, a second gate insulating film which is provided on a secondchannel region between the third and fourth diffusion layers, a lowerelectrode which is provided on the second gate insulating film, a secondinter-electrode insulating film which is provided on the lowerelectrode, and an upper electrode which is provided on the secondinter-electrode insulating film. The lower electrode and the upperelectrode are electrically connected via an opening provided on thesecond inter-electrode insulating film, the first and secondinter-electrode insulating films include a high-permittivity material,the first inter-electrode insulating film has a first structure, and thesecond inter-electrode insulating film has a second structure differentfrom the first structure.

A nonvolatile semiconductor memory device according to an aspect of theinvention comprises a memory cell and a peripheral transistor, which areprovided on a semiconductor substrate. The memory cell includes firstand second diffusion layers, a first gate insulating film which isprovided on a first channel region between the first and seconddiffusion layers, a charge storage layer which is provided on the firstgate insulating film, a dielectric film which is provided on the chargestorage layer, and a control gate electrode which is provided on thedielectric film. The peripheral transistor includes third and fourthdiffusion layers, a second gate insulating film which is provided on asecond channel region between the third and fourth diffusion layers, anda gate electrode which is provided on the second gate insulating film.The dielectric film includes a high-permittivity material, and thehigh-permittivity material is not present just above, just below andinside the gate electrode of the peripheral transistor.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is a circuit diagram showing a NAND cell unit;

FIG. 2 is plan view showing a NAND cell unit;

FIG. 3 is a cross-sectional view taken along line II-III of FIG. 2;

FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 2;

FIG. 5 is a cross-sectional view showing an example of aninter-electrode insulating film;

FIG. 6 is a cross-sectional view showing an example of theinter-electrode insulating film;

FIG. 7 is a cross-sectional view showing an example of theinter-electrode insulating film;

FIG. 8 is a cross-sectional view showing a peripheral transistor;

FIG. 9 is a cross-sectional view showing the peripheral transistor;

FIG. 10 is a cross-sectional view showing an example of theinter-electrode insulating film;

FIG. 11 is a cross-sectional view showing an example of theinter-electrode insulating film;

FIG. 12 is a cross-sectional view showing one step of a manufacturingmethod;

FIG. 13 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 14 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 15 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 16 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 17 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 18 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 19 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 20 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 21 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 22 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 23 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 24 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 25 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 26 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 27 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 28 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 29 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 30 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 31 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 32 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 33 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 34 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 35 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 36 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 37 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 38 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 39 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 40 is a cross-sectional view showing one step of the manufacturingmethod;

FIG. 41 is a cross-sectional view showing the NAND cell unit;

FIG. 42 is a cross-sectional view showing the NAND cell unit;

FIG. 43 is a cross-sectional view showing the peripheral transistor;

FIG. 44 is a cross-sectional view showing the peripheral transistor;

FIG. 45 is a cross-sectional view showing the memory cell and theperipheral transistor;

FIG. 46 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 47 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 48 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 49 is a cross-sectional view showing a step of the manufacturingmethod:

FIG. 50 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 51 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 52 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 53 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 54 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 55 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 56 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 57 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 58 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 59 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 60 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 61 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 62 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 63 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 64 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 65 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 66 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 67 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 68 is a cross-sectional view showing the memory cell and theperipheral transistor;

FIG. 69 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 70 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 71 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 72 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 73 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 74 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 75 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 76 is a cross-sectional view showing a step of the manufacturingmethod;

FIG. 77 is a cross-sectional view showing an application to a MONOS typememory cell;

FIG. 78 is a diagram showing a system as an application;

FIG. 79 is a diagram showing a layout of a semiconductor memory; and

FIG. 80 is a diagram showing the NAND cell unit.

DETAILED DESCRIPTION OF THE INVENTION

A nonvolatile semiconductor memory device of an aspect of the presentinvention will be described below in detail with reference to theaccompanying drawings.

1. Outline

In an example of the present invention, in order to eliminate a badinfluence upon a peripheral transistor at the time of using ahigh-permittivity material for an inter-electrode insulating film(dielectric film) of a memory cell, a structure of the inter-electrodeinsulating film of the peripheral transistor is made to be differentfrom that of the memory cell.

For example, when the inter-electrode insulating film of the memory cellhas a first structure composed of the high-permittivity material or alaminated layer including this material, the inter-electrode insulatingfilm of the peripheral transistor has a second structure including theentire first structure, and further has a blocking insulating filmbetween the first structure and a lower electrode.

Alternatively, an upper electrode is formed directly on the lowerelectrode of the peripheral transistor, and the inter-electrodeinsulating film does not have to be present between the lower electrodeand the upper electrode.

Even when the high-permittivity material is used for the inter-electrodeinsulating film of the memory cell, such a structure prevents carbonatoms and nitrogen radicals generated at the time of deposition fromdiffusing a surface of a semiconductor substrate and a bottom portion ofa field insulation insulating film.

The same holds true after the inter-electrode insulating film isdeposited.

Therefore, when the high-permittivity material is used for theinter-electrode insulating film of the memory cell, the performance ofthe peripheral transistor can be prevented from being deterioratedwithout increasing a process cost.

2. Embodiments

A NAND type nonvolatile semiconductor memory device according toembodiments of the present invention will be described.

Terms used in the embodiments are defined as follows.

The peripheral transistor is a transistor other than a memory cell (celltransistor), and mainly refers to a P-channel MOS transistor and anN-channel MOS transistor constituting a peripheral circuit. Theperipheral transistor includes both a low-voltage type MOS transistorand a high-voltage type MOS transistor.

The inter-electrode insulating film is an insulating film presentbetween two electrodes. For the memory cell, the inter-electrodeinsulating film is an insulating film present between a floating gateelectrode (charge storage layer) and a control gate electrode. For theperipheral transistor, the inter-electrode insulating film is aninsulating film present between the lower electrode and the upperelectrode.

The present invention can be applied also to a so-called MONOS typememory cell.

In this case, the memory cell has a charge storage layer composed of aninsulator instead of a floating gate electrode.

In this embodiment, therefore, the insulating film, including theinter-electrode insulating film, present between the charge storagelayer (including floating gate electrode) and the control gate electrodeis called a dielectric film.

The blocking insulating film is an insulating film present between thelower electrode and the dielectric film (a portion of theinter-electrode insulating film having the same structure as theinter-electrode insulating film of the memory cell) of the peripheraltransistor. The blocking insulating film has a function to blockdiffusion of the carbon atoms and the nitrogen atoms.

A thin oxide film obtained by natural oxidization can be present betweenthe blocking insulating film and the lower electrode.

The high-permittivity (High-k) material refers to a silicon nitride filmand an insulator including a material with a relative permittivity thanthat of the silicon nitride film.

In a memory cell array area, a first direction (column direction) and asecond direction (row direction) are perpendicular to each other. In aperipheral circuit area, a channel length direction and a channel widthdirection are perpendicular to each together.

(1) First Embodiment

A. Structure

[Memory Cell]

FIG. 1 is a circuit diagram showing a NAND cell unit.

The NAND cell unit 1 is composed of a NAND string including memory cellsM0, . . . M15 connected in series, and select gate transistors S1 and S2connected to both ends of the NAND string, respectively.

The memory cells M0, . . . M15 have a stacked gate structure having afloating gate electrode and a control gate electrode. Word lines 2 (WL0,. . . WL15) extend to the second direction (row direction) and areconnected to the control gate electrodes of the memory cells M0, . . .M15, respectively.

A side of the select gate transistor S1 opposite to the NAND string sideis connected to a bit line BL. The bit line BL extends in the firstdirection (column direction). A select gate line (block select line) 3(SSL) extends in the second direction and is connected to a select gateelectrode of the select gate transistor S1.

A side of the select gate transistor S2 opposite to the NAND string isconnected to a source line SL. A select gate line (block select line) 3(GSL) extends in the second direction and is connected to a select gateelectrode of the select gate transistor S2.

In this embodiment, the number of memory cells constituting the NANDstring is 16 (=2⁴), but this can be any value as long as the number ofmemory cells is more than one. However, the number 2 n (n is a positiveinteger) is preferable from the viewpoint of address decode. Any one ofthe select gate transistors S1 and S2 can be omitted and each of theselect gate transistors S1 and S2 can be comprised of a plurality oftransistors connected in series.

FIG. 2 is a plan view showing the NAND cell unit. FIG. 3 is across-sectional view taken along line III-III of FIG. 2, and FIG. 4 is across-sectional view taken along line IV-IV of FIG. 2.

A double well region composed of an n-type well region 5 and a p-typewell region 6 is formed in a p-type silicon substrate 4. The NAND cellunit is formed in the p-type well region 6.

The p-type well region 6 is set so that the boron density falls withinthe range of 1×10¹⁴ cm⁻³ to 1×10¹⁹ cm⁻³. Since the p-type well region 6is isolated from the p-type silicon substrate 4 by the n-type wellregion 5, a voltage can be applied to the p-type well region 6independently from the p-type silicon substrate 4.

As a result, for example, when data in the memory cells in the NAND cellunit is erased, an erasing voltage can be applied only to the p-typewell region 6. For this reason, a load on a boost circuit is furtherreduced and thus power consumption is further suppressed in comparisonwith a case where the erasing voltage is applied to the p-type siliconsubstrate 4.

A gate insulating film 7 having a thickness of 3 nm to 15 nm, forexample, is formed on the surface of the p-type well region 6. The gateinsulating film 7 is composed of, for example, a silicon oxide film, anoxynitride film or the like.

Floating gate electrodes 8 of the memory cells and lower electrodes 9 ofthe select gate transistors are formed on the gate insulating films 7.The floating gate electrodes 8 and the lower electrodes 9 are composedof a conductive polysilicon film in which phosphorus or arsenic is addedup to a concentration of 1×10¹⁸ cm⁻³ to 1×10²¹ cm⁻³.

The thickness of the floating gate electrodes 8 and the lower electrodes9 is set within the range of 10 nm to 500 nm.

The floating gate electrodes 8 are formed in a self-alignment manner onactive areas partitioned by field isolation insulating films 13 made ofsilicon oxide films, respectively.

In this case, after the floating gate electrodes 8 are patterned, thep-type well region 6 is etched within the range of 0.05 μl to 0.5 μm,and the field isolation insulating films 13 are embedded in the etchedportions.

Inter-electrode insulating films (dielectric films) 10 having athickness of 5 nm to 30 nm are formed on the floating gate electrodes 8.Similarly, the inter-electrode insulating films 10 having a thickness of5 nm to 30 nm are formed on the lower electrodes 9.

Control gate electrodes 11 and upper electrodes 12 are formed on theinter-electrode insulating films 10. The control gate electrodes 11 andthe upper electrodes 12 are made of a conductive polysilicon film inwhich phosphorus or arsenic is added within the concentration of 1×10¹⁷cm⁻³ to 1×10²¹ cm⁻³, or a stacked structure composed of the conductivepolysilicon film and a metal silicide film (for example, WSi, NiSi,MoSi, TiSi, CoSi).

The control gate electrodes 11 have a thickness of 10 nm to 500 nm, andare formed continuously in the second direction (row direction) of thememory cell array. As a result, the control gate electrodes 11 becomeword lines 2 (WL0 to WL15).

Similarly, the upper electrodes 12 have a thickness of 10 nm to 500 nm,and are formed continuously in the second direction (row direction) ofthe memory cell array. As a result, the upper electrodes 12 become theselect gate lines 3 (SSL, GSL).

The lower electrodes 9 and the upper electrodes 12 of the select gatetransistors are electrically connected to each other via openingsprovided on the inter-electrode insulating film 10.

The memory cells and the select gate transistors are connected in seriesby diffusion layers X, so as to constitute the NAND cell unit.

The source diffusion layer X (SL), which is one end of the NAND cellunit, is connected to the source line SL, and the drain diffusion layerX (BL), the other end thereof, is connected to the bit line BL whichextends to the first direction (column direction).

The inter-electrode insulating films 10 are composed of ahigh-permittivity (High-k) material, for example, an insulating filmcontaining a metal oxide such as HfAlO, HfSiOx and Al₂O₃ in order toimprove a coupling ratio of the memory cells.

Specifically, the inter-electrode insulating film 10 can have a singlelayered structure composed of only a high-permittivity material as shownin FIG. 5, or can have a three-layered structure of silicon nitridefilm/high-permittivity material/silicon nitride film or silicon oxidefilm/high-permittivity material/silicon oxide film as shown in FIG. 6.

As shown in FIG. 7, the inter-electrode insulating film 10 can have afive-layered structure of silicon nitride film/silicon oxidefilm/high-permittivity material/silicon oxide film/silicon nitride film.

[Peripheral Transistor]

FIGS. 8 and 9 are cross-sectional views showing a peripheral transistor.

FIG. 8 is a cross section in a channel length direction, and FIG. 9 is across section in a channel width direction.

Examples of the peripheral transistor include n-type MISFET and p-typeMISFET transistors from the viewpoint of conductive type, andlow-voltage MISFET and high-voltage MISFET transistors from theviewpoint of a breakdown voltage. Further examples thereof includeenhancement type and depletion type transistors from the viewpoint ofon/off operations.

A gate insulating film 16 is formed on the surface of a p-type wellregion 15. The gate insulating film 16 can be formed on the surface of ap-type semiconductor substrate instead of the p-type well region 15.

A lower electrode 17 is formed on the gate insulating film 16. Upperelectrodes 3 and 19 are formed on the lower electrode 17 via aninter-electrode insulating film (dielectric film) 18. The lowerelectrode 17 and the upper electrodes 3 and 19 are electricallyconnected via an opening 14 provided in the inter-electrode insulatingfilm 18.

The inter-electrode insulating film 18 is composed of an insulating filmincluding a high-permittivity material such as HfAlO, HfSiOx or Al₂O₃.The inter-electrode insulating film 18 has a structure different fromthat of the inter-electrode insulating film of the memory cell.

Specifically, as shown in FIG. 10, the inter-electrode insulating film18 has a two-layered structure of a blocking insulatingfilm/high-permittivity material.

As shown in FIG. 11, the inter-electrode insulating film 18 can have afour-layered structure of a blocking insulating film/silicon nitridefilm/high-permittivity material/silicon nitride film or blockinginsulating film/silicon oxide film/high-permittivity material/siliconoxide film. Alternatively, as shown in FIG. 12, the inter-electrodeinsulating film 18 can have a six-layered structure of a blockinginsulating film/silicon nitride film/silicon oxidefilm/high-permittivity material/silicon oxide film/silicon nitride film.

The important thing here is that the structure of the portions of theinter-electrode insulating film 18 in the peripheral transistor exceptfor the blocking insulating film is the same as the structure of theinter-electrode insulating film 10 of the memory cell.

As a result, deposition of the blocking insulating film needs beperformed before the inter-electrode insulating film 10 of the memorycell is deposited. An increase in the number of steps in this examplecan be thus suppressed to the minimum.

The blocking insulating film constitutes the lowermost layer of theinter-electrode insulating film 18, and has a function to blockdiffusion of carbon atoms, nitrogen atoms and the like.

The blocking insulating film is preferably composed of a material havingextreme precision in view of its object. For example, an HTO (HighTemperature Oxide) film is efficient as the blocking insulating film.

For example, insulating films such as a silicon oxide film, a siliconnitride film and a silicon oxynitride film can be used as the blockinginsulating film.

The lower electrode 17 has the same structure as that of the floatinggate electrode in the memory cell, and the upper electrodes 3 and 19have the same structure as that of the control gate electrode in thememory cell.

A side wall insulating film is formed on side walls of the lowerelectrode 17 and the upper electrodes 3 and 19. A diffusion layer X as asource/drain is formed in the p-type well region 15.

With such a structure, even when a high-permittivity material is usedfor the inter-electrode insulating film of the memory cell, thediffusion of the carbon atoms and nitrogen atoms from theinter-electrode insulating film of the peripheral transistor can beprevented. For this reason, the carbon atoms and the nitrogen atoms donot become fixed charges in the semiconductor substrate.

Therefore, improvement in the coupling ratio of the memory cell iscompatible with improvement in peripheral transistor characteristics.

In the above description, the peripheral transistor is an n-type MISFET,but when the peripheral transistor is formed on the surface of then-type well region, it becomes a p-type MISFET.

When the peripheral transistor is a high-voltage MISFET, the gateinsulating film is thick and thus this transistor is easily influencedby a parasitic transistor. For this reason, the present invention isparticularly effective for a high-voltage MISFET.

B. Manufacturing Method

A method for manufacturing the memory cell and the peripheral transistorin the first embodiment will be described with FIGS. 13 to 40. FIGS. 13to 40 includes four cross sectional view as follows: the cross sectionalview along with the first direction, the cross sectional view along withthe second direction, the cross sectional view along with the channellength direction, and the cross sectional view along with the channelwidth direction.

As shown in FIGS. 13 to 16, the n-type well region 5 and the p-type wellregions 6 and 15 are formed in the p-type semiconductor substrate(silicon substrate) 4 according to an ion implantation method. The gateinsulating films (silicon oxide films) 7 and 16 are formed on the p-typewell regions 6 and 15, respectively, according to a thermal oxidationmethod. Thereafter, conductive films (for example, conductivepolysilicon films) 8′ and 17′ are formed on the gate insulating films 7and 16, respectively, according to the CVD method.

A resist pattern is formed on the conductive films 8′ and 17′, and theconductive films 8′ and 17′, the gate insulating films 7 and 16, and thesemiconductor substrate (p-type well region) 4 are sequentially etchedby using the resist pattern as an etching mask according to RIE.

After trenches formed by the etching are filled with the field isolationinsulating film (STI: Shallow Trench Isolation) 13, the resist patternis removed. As a result, the structure of the memory cell shown in FIGS.13 and 14 is obtained, and the structure of the peripheral transistorshown in FIGS. 15 and 16 is obtained.

At this step, the thickness of the gate insulating film 16 of theperipheral transistor can be made different from the thickness of thegate insulating film 7 of the memory cell according to applications ofthe peripheral transistor. In this case, the gate insulating film 7 ofthe memory cell and the gate insulating film 16 of the peripheraltransistor are formed separately.

The trenches which filled the field isolation insulating film 13 can beformed also by using a hard mask (for example, silicon nitride film)patterned by resist pattern as an etching mask according to RIE.

As shown in FIGS. 17 to 20, the blocking insulating film 20 having athickness of 1 nm to 20 nm is formed on the conductive films 8′ and 17′and the field isolation insulating film 13.

The blocking insulating film 20 should block the diffusion of carbonatoms and nitrogen atoms which causes fixed charges in the semiconductorsubstrate 4. For this reason, an HTO film (silicon oxide film) havingextreme precision is used as the blocking insulating film.

As shown in FIGS. 21 to 24, a photoresist film (resist pattern) 21 whichcovers the peripheral transistor but does not cover the memory cell areais formed.

Using the photoresist film 21 as an etching mask, the blockinginsulating film 20 which is present in the memory cell area is removedby etching gas or chemical solution. As a result, as shown in FIGS. 25to 28, the blocking insulating film 20 remains in the peripheraltransistor area.

The etching gas or chemical solution which can sufficiently secureetching selectivity between the conductive film 8′ and the blockinginsulating film 20 in the memory cell area is used.

As a result, solely the blocking insulating film 20 can be etched withthe conductive film 8′ being left. At this time, the field isolationinsulating film 13 in the memory cell area can be etched back.

Due to this etching-back, the upper surface of the field isolationinsulating film becomes lower than the upper surface of the conductivefilm 8′ in the memory cell area, so that the side surface of theconductive film 8′ is partially exposed.

Thereafter, the photoresist film 21 which covered the peripheraltransistor area is removed.

As shown in FIGS. 29 to 32, the inter-electrode insulating film(dielectric film) 10 is formed on the conductive film 8′, the blockinginsulating film 20, and the field isolation insulating film 13.

The inter-electrode insulating film 10 is composed of ahigh-permittivity material or has a laminated structure including thismaterial.

In the memory cell area, the inter-electrode insulating film 10 coversthe upper surface and a part of the side surface of the conductive film8′.

In the peripheral transistor area, the inter-electrode insulating film10 and the blocking insulating film 20 constitute the inter-electrodeinsulating film (dielectric film) 18.

Openings are formed partially on the inter-electrode insulating film 18.

As shown in FIGS. 33 to 36, a conductive polysilicon film and a metallicsilicide film (for example, WSi, NiSi, MoSi, TiSi, CoSi) are formed onthe inter-electrode insulating films 10 and 18 by the CVD method or asputtering method.

Thereafter, the metallic silicide film and the conductive polysiliconfilm are etched by using the resist pattern or the hard mask as theetching mask according to RIE. Further, the inter-electrode insulatingfilm, the conductive film and the gate insulating film under them aresequentially etched, and gates of the memory cell and the peripheraltransistor are patterned.

As a result, the floating gate electrode 8 and the control gateelectrodes (word lines) 2 and 11 of the memory cell are formed in thememory cell area. The lower electrode 9 and the upper electrodes (selectgate lines) 3 and 12 of the select gate transistor are formed.

The lower electrode 17 and the upper electrodes 3 and 19 of theperipheral transistor are formed in the peripheral transistor area. Thelower electrode 17 and the upper electrodes 3 and 19 are electricallyconnected via the opening of the inter-electrode insulating film 18.

An n-type impurity (phosphorus or arsenic) is injected into the p-typewell regions 6 and 15 by using the control gate electrodes 2 and 11 ofthe memory cell, the upper electrodes 3 and 12 of the select gatetransistor and the upper electrodes 3 and 19 of the peripheraltransistor as the masks according to an ion implantation method.

A side wall insulating film Y is formed on the side walls of the controlgate electrodes 2 and 11 and the floating gate electrode 8 in the memorycell, the side walls of the upper electrodes 3 and 12 and the lowerelectrode 9 in the select gate transistor, and the side walls of theupper electrodes 3 and 19 and the lower electrode 17 in the peripheraltransistor.

An n-type impurity (phosphorus or arsenic) is injected into the p-typewell regions 6 and 15 by using the side wall insulating film Y, thecontrol gate electrodes 2 and 11 of the memory cell, the upperelectrodes 3 and 12 of the select gate transistor, and the upperelectrodes 3 and 19 of the peripheral transistor as the masks accordingto the ion implantation method. As a result, n-type diffusion layers X,X(SL) and X(BL) are formed.

As shown in FIGS. 37 to 40, the inter-electrode insulating film whichcovers the memory cell, the select gate transistor and the peripheraltransistor, is formed.

The n-type diffusion layer (source diffusion layer) X (SL) of the NANDcell unit is connected to the source line SL, and the n-type diffusionlayer (drain diffusion layer) X (BL) is connected to the bit line BL.The n-type diffusion layer X and the upper electrodes 3 and 19 of theperipheral transistor are connected to electrodes.

With the above steps, the memory cell and the peripheral transistoraccording to the present invention are completed.

C. Conclusion

According to the first embodiment, the inter-electrode insulating filmof the peripheral transistor includes the blocking insulating film so asto have a structure different from that of the inter-electrodeinsulating film of the memory cell. As a result, an off-leak currentcaused by accumulation of the impurities such as carbon atoms andnitrogen atoms on an interface between the semiconductor substrate andthe field isolation insulating film can be suppressed.

(2) Second Embodiment

FIGS. 41 to 44 show the nonvolatile semiconductor memory deviceaccording to a second embodiment.

The second embodiment is a modification of the first embodiment.

The structure of the NAND cell unit (the memory cell and the select gatetransistor) is the same as that in the first embodiment.

As the inter-electrode insulating film 10, therefore, the single-layeredstructure of FIG. 5, the three-layered structure of FIG. 6, and thefive-layered structure of FIG. 7 can be adopted.

The second embodiment is different from the first embodiment in thestructure of the peripheral transistor. Specifically, theinter-electrode insulating film is not present between the lowerelectrode 17 and the upper electrodes 3 and 19 of the peripheraltransistor. The other parts of the structure are the same as those inthe first embodiment. That is, all upper surface of the lower electrode17 is contact with the lower surface of the upper electrodes 3 and 19.And no inter-electrode insulating film is provided on the fieldisolation insulating film 13. Further more, the lower surface of theupper electrode 19 continuously contacts with an area from the sidesurface of the lower electrode 17 to the side surface and the uppersurface of the field isolation insulating film 13.

Therefore, the lower electrode 17 and the upper electrodes 3 and 19 arecollectively considered as the gate electrodes of the peripheraltransistor. That is, a high-permittivity material is not present justabove, just below and inside the gate electrode.

A high-permittivity material which causes fixed charges in thesemiconductor substrate is not used as a component of the peripheraltransistor, thereby preventing deterioration in performance of theperipheral transistor.

(3) Third Embodiment

The third embodiment is an application of the first embodiment andincludes all the characteristics of the first embodiment. In the thirdembodiment, availability of the present invention is studied separatelyfor the low-voltage peripheral transistor and the high-voltageperipheral transistor.

A. Structure

FIG. 45 shows the nonvolatile semiconductor memory device according tothe third embodiment.

The structures of the memory cell and the select gate transistor in thememory cell array are the same as those in the first embodiment exceptfor the following point.

An opening is formed on the upper electrode (for example, conductivepolysilicon film) 12 and the inter-electrode insulating film 10 of theselect gate transistor. The metallic silicide film 3 is connecteddirectly to the lower electrode (for example, conductive polysiliconfilm) 9 via the opening.

A low-voltage transistor and a high-voltage transistor are present inthe peripheral circuit.

The structure of the low-voltage transistor in the peripheral circuit isthe same as that of the peripheral transistor in the first embodimentexcept for the following point.

An opening is formed on the upper electrode (for example, conductivepolysilicon film) 19 and the inter-electrode insulating film 18 of thelow-voltage transistor. The metallic silicide film 3 is connecteddirectly to the lower electrode (for example, conductive polysiliconfilm) 17 via the opening.

The gate insulating film of the high-voltage transistor in theperipheral circuit has a thickness different from that of thelow-voltage transistor. That is, the gate insulating film 16B of thehigh-voltage transistor is thicker than the gate insulating film 16A ofthe low-voltage transistor.

The thickness of the gate insulating film 16A of the low-voltagetransistor is set within the range of 5 nm to 15 nm, for example. Thethickness of the gate insulating film 16B in the high-voltage transistoris set within the range of 20 nm to 60 nm, for example.

A voltage to be applied to the gate insulating film 16B of thehigh-voltage transistor is higher than a voltage to be applied to thegate insulating film 16A of the low-voltage transistor.

In the peripheral circuit, the upper surface of the field isolationinsulating film 13 is flush with the upper surface of the lowerelectrode 17.

This is because, since the inter-electrode insulating film 18 on thefield isolation insulating film 13 is far from the p-type well region(semiconductor substrate) 15, the upper electrodes 3 and 19 on the fieldisolation insulating film 13 are also far from the p-type well region15. As a result, generation of a parasitic transistor can be prevented,and a field isolation breakdown voltage can be improved.

The components of the third embodiment corresponding to those of thefirst embodiment are denoted by the same numerals as those in the firstembodiment.

In the third embodiment, similarly to the first embodiment, ahigh-permittivity material is used for the inter-electrode insulatingfilm 10. In this case, the carbon atoms in the gas to be used fordeposition of the high-permittivity material diffuse as shown by anarrow 100. When a plasma nitride film is used for the inter-electrodeinsulating film 10, nitrogen radicals diffuse similarly.

When such impurities reach a bottom portion 200 of the field isolationinsulating film 13, the generation of a parasitic transistor in the areaof the field isolation insulating film 13 is fostered. Particularly, anoff-leak of the peripheral transistor increases, and thus the fieldisolation breakdown voltage is lowered.

The low-voltage transistor and the high-voltage transistor in theperipheral circuit have the blocking insulating film 20 which preventsthe diffusion of impurities such as carbon atoms and nitrogen radicals.

For this reason, as shown by an arrow in FIG. 45B, the impurities do notreach the bottom portion of the field isolation insulating film 13, andthus the increase in the off-leak current is suppressed.

When the inter-electrode insulating film of the memory cell includes theblocking insulating film, the coupling ratio is lowered. For thisreason, the blocking film is not provided into the inter-electrodeinsulating film of the memory cell.

The select gate transistor may or may not include the blockinginsulating film.

In this embodiment, the inter-electrode insulating film of the selectgate transistor does not include the blocking insulating film in orderto reduce an increasing amount of the off-leak current of the selectgate transistor due to impurity diffusion and to reduce the processcost.

B. Manufacturing Method

A method for manufacturing the memory cell and the peripheral transistorin the third embodiment will be described.

The manufacturing method which obtains the structure of the presentinvention without changing parameters such as the height of the floatinggate electrode and a drop amount of the inter-electrode insulating filmis proposed below.

According to this manufacturing method, the memory deices havingexcellent characteristics can be realized by the same specification asthat of conventional techniques.

As shown in FIG. 46, the gate insulating film (silicon oxide film) 16Bwith a thickness of 20 nm to 60 nm is formed on the p-type well regions6 and 15 according to the thermal oxidation method.

The p-type well regions 6 and 15 can be n-type well regions. The gateinsulating film 16B can be formed not on the well region but on thesemiconductor substrate.

As shown in FIG. 47, a resist pattern 300 is formed according to PEP(Photo Engraving Process). The resist pattern 300 covers thehigh-voltage transistor area in the peripheral circuit and has openingson portions other than the high-voltage transistor area.

The gate insulating film 16B which is present on the portions other thanthe high-voltage transistor area is removed by using the resist pattern300 as a mask and using a chemical solution, and the resist pattern 300is removed. As a result, as shown in FIG. 48, the gate insulating film16B remains only on the high-voltage transistor area.

As shown in FIG. 49, the gate insulating films 7 and 16A with athickness of 5 nm to 15 nm are again formed on the p-well regions 6 and15 according to the thermal oxidation method.

As a result, the gate insulating films 7 and 16A with thickness of 5 nmto 15 nm are formed on the memory cell array area and the low-voltagetransistor area, and the gate insulating film 16B with a thickness of 20nm to 60 nm is formed on the high-voltage transistor area.

Then, as shown in FIG. 50, the conductive films (for example, conductivepolysilicon films) 8′, 9′ and 17′ are formed on the gate insulatingfilms 7, 16A and 16B according to the CVD method.

Subsequently, as shown in FIG. 51, an insulating film (for example,silicon nitride film) 400 as a hard mask is formed on the conductivefilms 8′, 9′ and 17′ according to the CVD method.

As shown in FIG. 52, a resist pattern 500 is formed on the insulatingfilm 400 according to PEP. The insulating film 400 is etched by usingthe resist pattern 500 as the etching mask according to RIE, so that thehard mask made of the insulating film 400 is formed.

Thereafter, the resist pattern 500 is removed.

As shown in FIG. 53, the insulating film 400 as the hard mask is used asan etching mask, and the conductive films 8′, 9′ and 17′ and the gateinsulating films 7, 16A and 16B are sequentially etched according toRIE. As a result, a structure shown in FIG. 54 is obtained.

As shown in FIG. 55, when the p-type well regions (semiconductorsubstrates) 6 and 15 are etched by using the insulating film 400 as theetching mask according to RIE, trenches for field isolation are formed.

Then, as shown in FIG. 56, the field isolation insulating film (forexample, silicon oxide film) 13 which fills the trenches completely isformed on the insulating film 400 according to the CVD method.

As shown in FIG. 57, the field isolation insulating film 13 is polishedaccording to a CMP (Chemical Mechanical Polishing) method until theupper surface of the field isolation insulating film 13 is approximatelyflush with the upper surface of the insulating film 400.

As shown in FIG. 58, the position of the upper surface of the fieldisolation insulating film 13 is adjusted.

In this embodiment, the field isolation insulating film 13 is furtheretched until its surface is approximately flush with the upper surfacesof the conductive films 8′, 9′ and 17′.

Thereafter, when the insulating film 400 as the hard mask is removed, astructure shown in FIG. 59 is obtained.

Then, as shown in FIG. 60, the blocking insulating film 20 is formed onthe conductive films 8′, 9′ and 17′ and the field isolation insulatingfilm 13 according to the CVD method.

The blocking insulating film 20 is composed of a material which preventsdiffusion of impurities and which does not become a source of impurity.Embodiments of such a material include a precise silicon oxide filmrepresented by an HTO (High Temperature Oxide) film and a siliconnitride film formed by the CVD method.

A lower limit of the thickness of the blocking insulating film 20 is 5nm, from the viewpoint of the prevention of impurity diffusion. Itsupper limit is ((dFG−20)/3) nm for the HTO film, and ((dFG-20)/2) nm forthe silicon nitride film. dFG is a thickness of the conductivepolysilicon film 8 as the charge storage layer of the memory cell.

The reason why the upper limit of the thickness of the blockinginsulating film 20 is set will be described later.

As shown in FIG. 61, a resist pattern 500 which covers the peripheralcircuit area and has an opening in the memory cell array area is formedby PEP.

As shown in FIG. 62, the blocking insulating film 20 in the memory cellarray area is selectively etched by using the resist pattern 500 as theetching mask according to RIE.

At the time of this etching, the field isolation insulating film 13 tobe a substrate is also etched.

In the memory cell array area, at this stage, the upper surface of thefield isolation insulating film 13 is adjusted so as to be lower thanthe upper surfaces of the conductive films 8′ and 9′.

As a result, the side surfaces of the conductive films 8′ and 9′ arepartially exposed.

Thereafter, the resist pattern 500 is removed.

Next, as shown in FIG. 63, the inter-electrode insulating film 10 isformed on the conductive films 8′, 9′ and 17′ and the field isolationinsulating film 13. The inter-electrode insulating film 10 has thesingle-layered structure shown in FIG. 5, the three-layered structureshown in FIG. 6, or the five-layered structure shown in FIG. 7.

In this case, in the peripheral circuit area, the blocking insulatingfilm 20 and the inter-electrode insulating film 10 form theinter-electrode insulating film 18 of the peripheral transistor.

As shown in FIG. 64, the conductive films (for example, conductivepolysilicon films) 11′ and 19′ are formed on the inter-electrodeinsulating films 10 and 18, respectively, by the CVD method.

Then, as shown in FIG. 65, a resist pattern 600 is formed on theconductive films 11′ and 19′ by lithography.

The conductive films 11′ and 19′ and the inter-electrode insulatingfilms 10 and 18 are etched by using the resist pattern 600 as theetching mask according to RIE. When the resist pattern 600 is removed,openings are formed on these films as shown in FIG. 66.

The openings are used for coupling the upper electrodes and the lowerelectrodes of the select gate transistor, the low-voltage transistor andthe high-voltage transistor.

The etching amount is adjusted so that distances between the bottomsurfaces of the openings and the upper surfaces of the gate insulatingfilms 7, 16A and 16B become 20 nm or more. When this condition issatisfied, the chemical solution can be prevented from spreading intothe gate insulating films 7, 16A and 16B in a cleaning process to beexecuted later.

Next will be described factors influencing the etching amount.

Since the blocking insulating film 20 is introduced into the peripheralcircuit area, the etching amount of the conductive films 8′ and 9′increases correspondingly in the memory cell array area.

Also in this case, the upper limit of the thickness of the blockinginsulating film 20 for satisfying the above specification (20 nm ormore) is formulated.

The upper limit of the thickness of the blocking insulating film 20 isdetermined by:

-   -   etching selectivity between the conductive films 8′ and 9′ and        the blocking insulating film 20; and    -   the thickness of the conductive films 8′ and 9′.

When the thickness of the conductive film 8′ as the charge storage layerof the memory cell is dFG[nm], the thickness of the blocking insulatingfilm 20 is dBL[nm], and the etching selectivity between the conductivefilms 8′, 9′ and 17′ and the blocking insulating film 20 is:

R=vFG/vBL

(where vBL[nm/s] is an etching rate of the blocking insulating film 20,and vFG[nm/s] is an etching rate of the conductive films 8′, 9′ and17′), time t[s] necessary for opening the blocking insulating film 20 isobtained as follows:

t=dBL/vBL  (1)

On the other hand, in the memory cell array, the thickness of theconductive film 9′ at the opening should be set to 20 nm or more.

That is, the following relationship should hold:

vFG×t≦dFG−20 nm  (2)

When the formulas (1) and (2) are simultaneously solved for dBL,

the upper limit which should be satisfied by dBL:

dBL≦(dFG−20 nm)/R

is determined.

The etching selectivity R changes according to the material constitutingthe conductive films 8′, 9′ and 17′ and the material constituting theblocking insulating film 20.

When the conductive films 8′, 9′ and 17′ are conductive polysiliconfilms, when the blocking insulating film 20 is a silicon nitride film,R≈2, and when the blocking insulating film 20 is HTO, R≈3.

Therefore, the thickness of the blocking insulating film 20 falls withinthe range of:

for HTO: 5 [nm]≈dBL≦(dFG−20)/3 [nm]

for the silicon nitride film:

5 [nm]dBL(dFG−20)/2 [nm]

after the lower limit of the thickness (5 nm) is taken intoconsideration.

As shown in FIG. 67, after the metallic silicide film is formed, themetallic silicide film, the conductive film, the inter-electrodeinsulating film, the conductive film and the gate insulating film arepatterned so that a gate is patterned.

As a result, in the memory cell area, the floating gate electrode 8 andthe control gate electrodes (word lines) 2 and 11 of the memory cell areformed, and the lower electrode 9 and the upper electrodes (select gatelines) 3 and 12 of the select gate transistor are formed.

In the peripheral transistor area, the lower electrode 17 and the upperelectrodes 3 and 19 of the low-voltage transistor and the high-voltagetransistor are formed. The lower electrode 17 and the upper electrodes 3and 19 are electrically connected via the opening of the inter-electrodeinsulating film 18.

Thereafter, when a source/drain diffusion layer and an electrode areformed by a publicly-known process, the nonvolatile semiconductor memorydevice of the third embodiment is completed.

C. Conclusion

According to the third embodiment, the following effects can beobtained.

-   -   The formation of the blocking insulating film prevents diffusion        of impurities to the bottom portion and the side portion of the        field isolation insulating film, and the increase in the        off-leak current of the peripheral transistor due to the        impurities and the reduction in the field isolation breakdown        voltage are suppressed.    -   For the HTO film, the thickness dBL of the blocking insulating        film falls within the range of 5 nm≦dBL≦(dFG−20)/3 nm. For the        silicon nitride film, the thickness falls within the range of 5        nm≦dBL≦(dFG−20)/2 nm. As a result, the diffusion of the        impurities at the time of forming the inter-electrode insulating        film is prevented, and an opening process on the inter-electrode        insulating film in the memory cell array area and an opening        process on the inter-electrode insulating film and the blocking        insulating film in the peripheral circuit area are executed at        the same step so that the process cost is reduced.    -   The blocking insulating film is prevented from remaining in the        select gate transistor in the memory cell array area. As a        result, the number of manufacturing steps is reduced more than        in a case where the blocking insulating film remains in the        select gate transistor.    -   The position of the lower surface of the control gate electrode        on the field isolation insulating film in the peripheral circuit        area is made to be higher than the position of the upper surface        of the floating gate electrode on the element area (active        area). As a result, the field isolation breakdown voltage is        improved.    -   As to the increase in the number of the manufacturing steps,        only a depositing step for the blocking insulating film is        added, and this additional step solves the problem of        deterioration of peripheral transistor characteristics due to        impurities.

(4) Fourth Embodiment

A. Structure

FIG. 68 shows the nonvolatile semiconductor memory device according to afourth embodiment.

The fourth embodiment is a modification of the third embodiment.

The structure of the NAND cell unit (memory cell and select gatetransistor) is the same as that in the first embodiment.

Therefore, the single-layered structure in FIG. 5, the three-layeredstructure in FIG. 6 and the five-layered structure in FIG. 7 can beadopted as the inter-electrode insulating film 10.

The fourth embodiment is different from the third embodiment in thestructure of the peripheral transistor. Specifically, theinter-electrode insulating film is not present between the lowerelectrode 17 and the upper electrodes 3 and 19 of the peripheraltransistor. The other parts of the structure are the same as those inthe third embodiment. That is, all upper surface of the lower electrode17 is contact with the lower surface of the upper electrodes 3 and 19.And no inter-electrode insulating film is provided on the fieldisolation insulating film 13. Further more, the lower surface of theupper electrode 19 continuously contacts with an area from the sidesurface of the lower electrode 17 to the side surface and the uppersurface of the field isolation insulating film 13.

Therefore, when the lower electrode 17 and the upper electrodes 3 and 19are collectively considered as the gate electrodes of the peripheraltransistor, a high-permittivity material is not present just above, justbelow and inside the gate electrodes.

A high-permittivity material which causes fixed charges in thesemiconductor substrate is not used as a component of the peripheraltransistor, thereby preventing deterioration in performance of theperipheral transistor.

B. Manufacturing Method

The method for manufacturing the memory cell and the peripheraltransistor according to the fourth embodiment will be described.

As shown in FIG. 69, the steps up to the step of making the uppersurface of the field isolation insulating film 13 approximately flushwith the upper surfaces of the conductive films 8′, 9′ and 17′ areexecuted in a manufacturing method similar to that in the thirdembodiment (FIGS. 42 to 59).

As shown in FIG. 70, the peripheral circuit area is covered with aphotoresist film 700, and the field isolation insulating film 13 in thememory cell array area is etched back. As a result, in the memory cellarray area, the upper surface of the field isolation insulating film 13becomes lower than the upper surfaces of the conductive films 8′ and 9′,and the side surfaces of the conductive films 8′ and 9′ are partiallyexposed.

As shown in FIG. 71, the inter-electrode insulating film 10 is formed onthe conductive films 8′, 9′ and 17′ and the field isolation insulatingfilm 13 by the CVD method. The inter-electrode insulating film 10 hasthe single-layered structure shown in FIG. 5, the three-layeredstructure shown in FIG. 6, or the five-layered structure shown in FIG.7.

In the memory cell array area, the inter-electrode insulating film 10covers the upper surfaces and part of the side surfaces of theconductive films 8′ and 9′.

As shown in FIG. 72, the memory cell array area is covered with thephotoresist film, and the inter-electrode insulating film 10 which ispresent in the peripheral circuit area is selectively removed.Thereafter, the photoresist film is also removed.

As shown in FIG. 73, the conductive films (for example, conductivepolysilicon films) 11′ and 19′ are formed on the inter-electrodeinsulating film 10, the conductive film 17′ and the inter-electrodeinsulating film 13 by the CVD method.

As shown in FIG. 74, a resist pattern 800 is formed on the conductivefilms 11′ and 19′ by PEP.

The conductive films 11′ and 19′ and the inter-electrode insulating film10 are etched by using the resist pattern 800 as the etching maskaccording to RIE. When the photoresist pattern 800 is removed, openingsare formed on these films as shown in FIG. 75.

The opening is for connecting the upper electrode and the lowerelectrode of the select gate transistor. Therefore, no opening may beprovided in the peripheral transistor area.

Similarly to the third embodiment, the etching amount is adjusted sothat distances between the bottom surfaces of the openings and the uppersurfaces of the gate insulating films 7, 16A and 16B become 20 nm ormore.

As shown in FIG. 76, after a metallic silicide film is formed, themetallic silicide film, the conductive film, the inter-electrodeinsulating film, the conductive film and the gate insulating film arepatterned, so that the gate is patterned.

As a result, in the memory cell area, the floating gate electrode 8 andthe control gate electrodes (word lines) 2 and 11 of the memory cell areformed. The lower electrode 9 and the upper electrodes (select gatelines) 3 and 12 of the select gate transistor are formed.

The lower electrode 17 and the upper electrodes 3 and 19 of thelow-voltage transistor and the high-voltage transistor are formed in theperipheral transistor area.

Thereafter, when the source/drain diffusion layer and the electrode areformed by the publicly-known process, the nonvolatile semiconductormemory device according to the fourth embodiment is completed.

C. Conclusion

Also in the fourth embodiment, the effects similar to those in the thirdembodiment can be obtained.

Particularly, since a high-permittivity material caused a fluctuation inthe characteristics of the peripheral transistor is not present in theperipheral circuit area, the nonvolatile semiconductor memory devicehaving high reliability can be realized.

(5) Fifth Embodiment

The first to fourth embodiments refer to the examples of the stack gatetype memory cells, but the present invention can be applied to an MONOStype memory cell.

FIG. 77 shows the nonvolatile semiconductor memory device according tothe fifth embodiment.

The characteristic of the fifth embodiment is that the memory cell is ofthe so-called MONOS type. In this case, the charge storage layer 24 ofthe memory cell is composed of an insulating film (for example, siliconnitride film).

A source/drain diffusion layer 22 is arranged in a semiconductorsubstrate (active area) 21. Gate insulating films 23A and 23B are formedon a channel region between the source-drain diffusion layers 22.

For the memory cell, the charge storage layer 24, a dielectric film 25and a control gate electrode (word line) 26 are formed on the gateinsulating film 23A. The dielectric film 25 includes a high-permittivity(High-k) material. In the peripheral transistor, the gate electrode 26is formed on the gate insulating film 23B.

Also in such a device structure, since the peripheral transistor doesnot have a high-permittivity material, the fluctuation in thecharacteristics of the peripheral transistor can be prevented.

3. Application

An example of a system to which the nonvolatile semiconductor memorydevice (semiconductor memory) of the present invention is applied willbe described.

FIG. 78 shows one example of the memory system.

This system is, for example, a memory card, or a USB memory.

A circuit board 32, and semiconductor chips 33, 34 and 35 are arrangedin a package 31. The circuit board 32 and the semiconductor chips 33, 34and 35 are electrically connected by a bonding wire 36. One of thesemiconductor chips 33, 34 and 35 is the nonvolatile semiconductormemory device (semiconductor memory) according to the present invention.

FIG. 79 shows a chip layout of the semiconductor memory.

Memory cell arrays 41A and 41B are arranged on a semiconductor chip 40.The memory cell arrays 41A and 41B each have blocks BK0, BK1, . . .BKn−1 which are arranged in the second direction. Each of the blocksBK0, BK1, . . . BKn−1 has cell units CU which are arranged in the firstdirection.

As shown in FIG. 80, the cell unit CU is composed of memory cells MCwhich are connected in series in the second direction, and two selectgate transistors ST which are connected to both ends of the memory cellsMC, respectively.

A bit line BL which extends in the second direction is arranged on thememory cell arrays 41A and 41B. A page buffer (PB) 43 is arranged onboth ends of the memory cell arrays 41A and 41B in the second direction.The page buffer 43 has a function to temporarily store readingdata/writing data at the time of reading/writing. The page buffer 43serves as a sense amplifier (S/A) at the time of reading or verificationof a writing/erasing operation.

A row decoder (RDC) 44 is arranged at one end (end portions opposite tothe end portion of the edge side of the semiconductor chip 40) of thememory cell arrays 41A and 41B in the first direction. A pad area 42 isarranged along the edge of the semiconductor chip 40 at one end of thememory cell arrays 41A and 41B in the second direction. A peripheralcircuit 45 is arranged between the page buffer 43 and the pad area 42.

4. Conclusion

According to the present invention, even when a high-permittivitymaterial is used for a dielectric film between the charge storage layerand the control gate electrode, the performance of the peripheraltransistor is not deteriorated.

Additional advantages and modifications will readily occur to thoseskilled in the art. Therefore, the invention in its broader aspects isnot limited to the specific details and representative embodiments shownand described herein. Accordingly, various modifications can be madewithout departing from the spirit or scope of the general inventiveconcept as defined by the appended claims and their equivalents.

What is claimed is:
 1. A nonvolatile semiconductor memory device comprising: a semiconductor substrate; a memory cell which is provided on the semiconductor substrate, including: first and second diffusion layers, a first gate insulating film which is provided on a first channel region between the first and second diffusion layers, a charge storage layer which is provided on the first gate insulating film, a first inter-electrode insulating film which is in contacting with the charge storage layer, and a control gate electrode which is provided on the first inter-electrode insulating film; and a first peripheral transistor which is provided on the semiconductor substrate, including: third and fourth diffusion layers, a second gate insulating film which is provided on a second channel region between the third and fourth diffusion layers, a first lower electrode which is provided on the second gate insulating film, a blocking insulating film in contact with the first lower electrode, a second inter-electrode insulating film which is provided on the blocking insulating film and comprises the same material as the first inter-electrode insulating film, and a first upper electrode which is provided on the second inter-electrode insulating film; a second peripheral transistor which is provided on the semiconductor substrate, including: fifth and sixth diffusion layers, a third gate insulating film which is provided on a second channel region between the fifth and sixth diffusion layers and thicker than the second gate insulating film, a second lower electrode which is provided on the third gate insulating film, the blocking insulating film in contact with the second lower electrode, a third inter-electrode insulating film which is provided on the blocking insulating film and comprises the same material as the first inter-electrode insulating film, and an second upper electrode which is provided on the third inter-electrode insulating film; wherein the first lower electrode and the first upper electrode are electrically connected via an opening provided on the second inter-electrode insulating film, the second lower electrode and the second upper electrode are electrically connected via an opening provided on the second inter-electrode insulating film, and the first and second inter-electrode insulating films and the third insulating film include a high-permittivity material.
 2. The nonvolatile semiconductor memory device according to claim 1, wherein the blocking insulating film is HTO, and a thickness dBL thereof is 5 [nm]≦dBL≦(dFG−20)/3 [nm] where dFG represents a thickness [nm] of the charge storage layer.
 3. The nonvolatile semiconductor memory device according to claim 1, wherein the blocking insulating film is a silicon nitride film, and a thickness dBL thereof is 5 [nm]≦dBL≦(dFG−20)/3 [nm] where dFG represents a thickness [nm] of the charge storage layer.
 4. The nonvolatile semiconductor memory device according to claim 1, wherein the high-permittivity material is metal oxide.
 5. The nonvolatile semiconductor memory device according to claim 1, wherein the memory cell is a memory cell in a NAND cell unit.
 6. The nonvolatile semiconductor memory device according to claim 1, further comprising: a third peripheral transistor which is provided on the semiconductor substrate adjacent to the memory cell, including seventh and eighth diffusion layers, a fourth gate insulating film which is provided on a second channel region between the seventh and eighth diffusion layers, and a thickness of the fourth gate insulating film is equal to that of the first gate insulating film, a third lower electrode which is provided on the fourth gate insulating film, a fourth inter-electrode insulating film which is directly contacted to the third lower electrode and comprises the same material as the first inter-electrode insulating film, and the third peripheral transistor not having the blocking insulating film, a third electrode which is provided on the fourth inter-electrode insulating film.
 7. The nonvolatile semiconductor memory device according to claim 1, wherein a thickness of the second gate insulating film is equal to that of the first gate insulating film.
 8. The nonvolatile semiconductor memory device according to claim 1, wherein the control gate electrode and the upper electrode include metallic silicide.
 9. The nonvolatile semiconductor memory device according to claim 1, wherein the floating gate electrode and the first and second lower electrodes are made from a same material, and the first and second control gate electrodes and the upper electrode are made from a same material.
 10. A nonvolatile semiconductor memory device comprising a semiconductor substrate; a memory cell which is provided on the semiconductor substrate, including: first and second diffusion layers, a first gate insulating film which is provided on a first channel region between the first and second diffusion layers, a charge storage layer which is provided on the first gate insulating film, a dielectric film which is provided on the charge storage layer, and a control gate electrode which is provided on the dielectric film; and a peripheral transistor which is provided on the semiconductor substrate, including: third and fourth diffusion layers, a second gate insulating film which is provided on a second channel region between the third and fourth diffusion layers, a first lower gate electrode which is provided on the second gate insulating film, and a first upper gate electrode provided on the first lower gate electrode, and an all bottom surface of the first upper gate electrode contacting to the first lower gate electrode, a third gate insulating film which is provided on a second channel region between the fifth and sixth diffusion layers and thicker than the second gate insulating film, a second lower gate electrode which is provided on the second gate insulating film, and a second upper gate electrode provided on the second lower gate electrode, and an all bottom surface of the second upper gate electrode contacting to the second lower gate electrode, and wherein the dielectric film includes a high-permittivity material.
 11. The nonvolatile semiconductor memory device according to claim 10, wherein the charge storage layer is composed of nitride.
 12. The nonvolatile semiconductor memory device according to claim 10, wherein the high-permittivity material is metal oxide.
 13. The nonvolatile semiconductor memory device according to claim 10, wherein the memory cell is a memory cell in a NAND cell unit.
 14. The nonvolatile semiconductor memory device according to claim 1, further comprising: a third peripheral transistor which is provided on the semiconductor substrate adjacent to the memory cell, including seventh and eighth diffusion layers, a fourth gate insulating film which is provided on a second channel region between the seventh and eighth diffusion layers, and a thickness of the fourth gate insulating film is equal to that of the first gate insulating film, a third lower electrode which is provided on the fourth gate insulating film, a second inter-electrode insulating film and comprises the same material as the first inter-electrode insulating film, and a third electrode which is provided on the fourth inter-electrode insulating film, wherein the third lower electrode and the third upper electrode are electrically connected via an opening provided on the second inter-electrode insulating film.
 15. The nonvolatile semiconductor memory device according to claim 10, wherein a thickness of the second gate insulating film is equal to that of the first gate insulating film.
 16. The nonvolatile semiconductor memory device according to claim 10, wherein the control gate electrode and the gate electrode include metal silicide.
 17. The nonvolatile semiconductor memory device according to claim 10, wherein the charge storage layer and the first and second lower portion of the gate electrodes are made from a same material, and the control gate electrode and the first and second upper portion of the gate electrodes are made from a same material. 